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High Density Digital I/O Expansion Boards

The High Density Digital I/O (HDIO) is a family of Input / Output Boards are designed to operate on the Divelbiss High Density I/O (HDIO) Bus. These I/O boards connect to Divelbiss Programmable Logic Controllers via a ribbon and power cable set and are addressed by field selectable jumpers.

The High Density Digital I/O Expansion Boards provide a variety of input voltages (115VAC, 24VAC, 10-32VDC) and Output voltages (24-115VAC, 10-32VDC). The High Density I/O outputs are available as solid-state modules, solid-state on-board and relay contacts. Compatible with the Enhanced Baby Bear, PCS, Boss32, Boss Bear, UCP and other programmable logic controllers, the High Density I/O expansion boards are an input/output solution for any need.

These Digital I/O Expander Boards connect to Divelbiss Programmable Logic Controllers via a ribbon and power cable set and are addressed by field selectable jumpers.
High Density Digital I/O Expansion Board
   
  • Standard Models
  • Build to Order / Other Models

The following Part Numbers / Models are typically available for purchase. Product Delivery time may vary.

Model Number   Description
     
ICM-HDIO-01P High Density Digital I/O Expansion Board. 16 Inputs (10-32VDC), 16 Outputs (10-32VDC@1A). Isolated. Made in the USA.
ICM-HDIO-02P High Density Digital I/O Expansion Board. 16 Inputs (10-32VDC), Isolated. Made in the USA.
ICM-HDIO-03P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC), 8 Outputs (10-32VDC@1A). Isolated. Made in the USA.
ICM-HDIO-04P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC), Isolated. Made in the USA.
ICM-HDIO-06P High Density Digital I/O Expansion Board 16 Inputs (10-32VDC) with 2 isolated commons, 16 Fused Outputs (10-32VDC@1A) with 2 isolated commons. Made in the USA.
ICM-HDIO-07P High Density Digital I/O Expansion Board. 16 Inputs (10-32VDC) with 2 isolated commons. Made in the USA.
ICM-HDIO-08P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC) with 1 isolated common, 8 Fused Outputs (10-32VDC@1A) with 1 isolated common. Made in the USA.
ICM-HDIO-09P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC) with 1 isolated common. Made in the USA.
ICM-HDIO-10P High Density Digital I/O Expansion Board. 8 Fused Outputs (10-32VDC@1A) with 1 isolated common. Made in the USA.
ICM-HDIO-11P High Density Digital I/O Expansion Board. 8 Inputs (115VAC) with 1 isolated common, 8 Fused Outputs (24-115VAC@1A) with 2 isolated commons. Made in the USA.
ICM-HDIO-12P High Density Digital I/O Expansion Board. 8 Inputs (115VAC) with 1 isolated common. Made in the USA.
ICM-HDIO-13P High Density Digital I/O Expansion Board. 8 Fused Outputs (24-115VAC@1A) with 2 isolated commons. Made in the USA.
ICM-HDIO-14P High Density Digital I/O Expansion Board. 8 Inputs (24VAC) with 1 isolated common, 8 Fused Outputs (24-115VAC@1A) with 2 isolated commons. Made in the USA.
ICM-HDIO-15P High Density Digital I/O Expansion Board. 8 Inputs (24VAC) with 1 isolated common. Made in the USA.
ICM-HDIO-16P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC) with 1 isolated common, 8 Fused Outputs (24-115VAC@1A) with 2 isolated commons. Made in the USA.
ICM-HDIO-17P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC) with 1 isolated common, 8 Output Sockets for relays (uses Divelbiss Part Number 125-101183, 5A, Dry Contact, N.O.). Made in the USA.
ICM-HDIO-19P High Density Digital I/O Expansion Board. 8 Output Sockets for relays (uses Divelbiss Part Number 125-101183, 5A, Dry Contact, N.O.). Made in the USA.
ICM-HDIO-20P High Density Digital I/O Expansion Board 8 Input/Output module slots. Accepts Opto-22 Input or Output Modules (Divelbiss Part Number 146-XXXXXX). Made in the USA.
ICM-HDIO-22P High Density Digital I/O Expansion Board. 8 Inputs (115VAC) with 1 isolated common, 8 Output Sockets for relays (uses ICM-RE-03, 10A). Form C configuration. Made in the USA.
ICM-HDIO-23P High Density Digital I/O Expansion Board. 8 Output Sockets for relays (uses ICM-RE-03, 10A). Form C configuration. Made in the USA.
ICM-HDIO-24P High Density Digital I/O Expansion Board. 8 Inputs (24VAC) with 1 isolated common, 8 Output Sockets for relays (uses ICM-RE-03, 10A). Form C configuration. Made in the USA.
ICM-HDIO-25P High Density Digital I/O Expansion Board. 8 Inputs (10-32VDC) with 1 isolated common, 8 Output Sockets for relays (uses ICM-RE-03, 10A). Form C configuration. Made in the USA.
ICM-HDLEAK-01 4 Channel Conductivity Detectors. Uses standard conductivity probes. Made in the USA.
ICM-HDBU-DR High Density Digital I/O Expansion Board Bus Driver. Extends length of High Density I/O Bus. Required ICM-HDBU-RC. Made in the USA.
ICM-HDBU-RC High Density Digital I/O Expansion Board Bus Receiver Extends length of High Density I/O Bus. Required ICM-HDBU-DR. Made in the USA.

The following products are either not stocked or are obsolete. Non-stocked Models will have varying delivery times. Most obsolete Models will have replacements available. See Product Details for replacements.

Model Number Description Status Replacement
       
ICM-HDIO-05P High Density I/O. 8 Outputs (10-32VDC@1A). Isolated. Made in the USA. Obsolete ICM-HDIO-03P